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 About Us

Curious Corp., Post OfficeOur Company was established in Junly,2001. We develop Analog/Mixed Signal (Analog/Digital Mixture) IC( Integrate Circuit). In the future, all information processing machines will be presumed to be connected over a form of network or another. As such demands for these machines are expected to increase considerably in the ever-expanding world of communication with this increase demands for the LCD Driver will also undoubtedly rise. With the present lack of analog design capacity in the world due to a shortage of analog engineers. Our main purpose is to work hard to provide our customers with the best expert advice and services possible.

Curious Corp., PDF File DownloadComapny Introduction

Company Name
CURIOUS Corporation
Office Address
[Tokyo Head Office]
Zip 101-0041
Metlife Kanda Sudacho BLD 8F
1-chome-10-2, Kanda Sudacho, Chiyoda City, Tokyo-to JAPAN
Phone +81-3-5207-2785
Google Map

[Sendai Design Center]
Zip 980-0802
Station Plaza BLD 805
13-18 Futsukamachi, Aoba-ku, Sendai, Miyagi JAPAN
Phone +81-22-302-6236
Google Map

[Sendai R&D Center]
Zip 981-3133
Izumi Central BLD 404
3-chome-10-3, Izimichuo, Izumi-ku, Sendai, Miyagi JAPAN
Phone +81-22-346-8435
Google Map

[Iwate Design Center]
Zip 021-0003
Pastrale 3-102
4-3, Higashigodai, Ichinoseki, Iwate JAPAN
Phone +81-191-32-5257
Google Map

President
Takayuki Onodera (CEO)
Contents
Development/Manufacture/Sales Of LSI
  1.  Sales of Semiconductor Products
  2.  Development of LSI
  3.  IP License & Support
Establishment
2001 July 9th
Capital
US$ 1,500,000- (2019 October)
Bank
  •  IWATE Bank Ichinoseki Branch Office
  •  MIZUHO Bank Sendai Branch Office
  •  KITANIPPON Bank Ichinoseki Branch Office
Fisical Year End
December 31th
Customer & Partner Company
  •  Panasonic Corporation(Japan)
  •  Panasonic Semiconductor Solutions Co., Ltd.(Japan)
  •  SONY Coporation(Japan)
  •  SONY Semiconductor Solutions Coporation(Japan)
  •  Nikon Corporation(Japan)
  •  Denso Corporation(Japan)
  •  Renesas Electronics Corporation(Japan)
  •  SHARP Coporation(Japan)
  •  NEC Coporation(Japan)
  •  FUJIFILM Co.,Ltd.(Japan)
  •  Cypress Semiconductor Corporation(USA)
  •  Cypress Innovates(Japan)
  •  Brookman Technology Inc.(Japan)
  •  Rosnes Corporation(Japan)
  •  Huawei Technologies Co., Ltd.(China) HUAWEI
  •  HiSilicon Technologies Co., Ltd.(China) HiSilicon
  •  Allwinner Technologies Co., Ltd.(China) Allwinner
  •  Vimicro Corporation(China) Vimicro
  •  Viewtel Corporation(USA) Viewtel
  •  Orbbec 3D Technology International, Inc.(USA) Orbbec
  •  Gpixel Inc.(China) Gpixel
  •  Shanghai CelePixel Co. Ltd(China) CelePixel
  •  Brillnics Inc.(Tawiwan) Brillnics
  •  Brillnics Japan Inc.(Japan) Brillnics Japan
  •  Hangzhou Hikvision Digital Technology Co., Ltd.(China) HIKvision
  •  HOLTEK Semiconductor Inc.(Taiwan) Holtek
  •  Winbond Electronics Corporation(Taiwan) Winbond
  •  Foxconn Technology Group(Taiwan) Foxconn
  •  Hon Hai Precision Industry(Taiwan) HonHai
  •  Faraday Technology(Taiwan) Faraday
  •  Faraday Technology Japan(Japan)
  •  Alchip Technologies, Ltd.(Taiwan) Alchip
  •  Global Unichip(Taiwan) GUC
  •  Open-Silicon, Inc.(USA) Open-Silicon
  •  VeriSilicon Inc.(USA) VeriSilicon
  •  Progate Group Corporation(Taiwan) PGC
  •  Brite Semiconductor Corporation(China) Brite
  •  TOSHIBA Corporation(Japan)
  •  MegaChips Corporation(Japan)
  •  Socinext Corporation(Japan)
  •  M31 Technology (Taiwan) M31
  •  ARM Ltd. (UK) ARM
  •  Toshiba Information Systems Corporation(Japan)
  •  Sanei Hytechs Co.,Ltd.(Japan)
  •  Toppan Printing Co.,Ltd.(Japan)
  •  Toppan Technical Design Center Co., Ltd.(Japan)
  •  Shanghai Bwave Technology Co.,Ltd.(China)Bwave
  •  HOYA Corporaion(Japan)
  •  Uozu Device Engineering Coporation(Japan)
  •  Linear Cell Design(Japan)
  •  Analogist(Japan)
  •  Terapixel Technologies Corporaion(Japan)
  •  Taiwan Semiconductor Manufacturing Company(Taiwan) TSMC
  •  TSMC Japan Limited(Japan) TSMCJ
  •  United Microelectronics Company(Taiwan) UMC
  •  Samsung Electronics Co., Ltd.(South Korea) Samsung
  •  Samsung Japan Corporation(Japan)
  •  UMC Group Japan(Japan) UMCGJ
  •  Towerjazz Panasonic Simiconductor Corporation(Japan) TPSCo
  •  Globalfoundries(USA) GF
  •  Semiconductor Manufacturing International Corporation(China) SMIC
  •  FUJIFILM Degital Techno Corpoation(Japan)
  •  HITACHI ULSI Systems Co.,Ltd.(Japan)
  •  OKI Engineering Co.,Ltd.(Japan)
  •  ASE Japan Co.,Ltd.(Japan)
  •  MITSUI High-tech, Inc.(Japan)
  •  OOI Electric Co.,Ltd.(Japan)
  •  TAITEC Corporation(Japan)
  •  NEC Tohoku, Ltd.(Japan)
  •  ACORN Logic Technology Corporation(Japan)
  •  Hong Xiang Technology Co.,Ltd.(Taiwan) HXT
  •  Altera Japan Corporation(Japan) Altera
  •  KANEMATSU Corporation(Japan) (Agant) [IC]
  •  Transilicon Corporation(China) (Agant) [IC & IP]Transilicon
  •  Shanghai Jiatao Industrial Co.,LTD(China) (Agant) [IP] Jiatao
  •  Zuiki Inc.(China/Japan) (Agant) [IP] Zuiki
  •  Triton Corporation(Taiwan/Japan) (Agant) [IP] Triton
  •  Maple Technology Inc.(South Korea) (Agant) [IC]
  •  UNIPIX Corporation(South Korea) (Agent) [IP]
  •  Marubun Corporation(Japan)
  •  Toyama Prefectural University(Japan)
  •  Bridge Roots Capital(Taiwan)
  •  Element III Venture Capital(Taiwan)
  •  Deloite Taiwan(Taiwan)
  •  TMI Associates Services Co., Ltd.(Japan)
  •  CURIOUS Holding Co., Ltd.(Taiwan)
e.t.c.